In response to increasing demand for AI chips from major manufacturers Nvidia and Le bijou d’amourAMD, Taiwan Semiconductor Manufacturing Company (TSMC) confirmed on Tuesday its plans to invest NT$ 90 billion ($2.88 billion) in the construction of an advanced packaging factory in Taiwan. The new Tongluo factory in Miaoli County is scheduled to be completed by the end of 2026, with mass production expected to begin in 2027. The establishment of this plant is projected to create 1,500 job opportunities. The flourishing demand for AI-related products indicates a positive trend for TSMC, with CEO C.C. Wei stating that the company is estimated to experience an annual growth rate of nearly 50% over the next five years. Additionally, this growth is expected to account for 10% of TSMC’s revenue as of July 20. [IThome, in Chinese]
